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24GB kit (6x4GB) Matched Pair:Fully Buffered:PC2-5300:ECC:DDR2-667:240pin DIMM for Mac Pro 2006-2007 Models [Model ID: 1,1 or 2,1]

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MaxUpgrades offers MaxSink, a heatsink designed to provide effective heat disspation of fully buffered DIMM memory modules operating at high speed 800 MHz or 667 Mhz (Mac Pro Systems) . MaxSink unique design allows heat generated from memory chips and Advance Memory Buffer to be effectively disspated while keeping the temperature of the memory module under operating limits.


Memory Upgrades for Mac Pros [Nehalem] Intel Xeon March 2009

MaxSink Features:
• Maximum Surface Area for Optimum Heat Dissipation.
• Precision Machined Aluminum HeatSink.
• Unique mounting for uniform pressure distribution.
• Lowest Thermal resistance between DRAM Chips (FBGA) and HeatSink for optimized heat transfer.
• Designed for fluctuating Memory Module temperature variations. (Heat Load)
• Step HeatSink design to incorporate thickness variation of AMB and FBGA (RAM Chips.
• HeatSink Surface Treated to minimize Thermal Resistance between HeatSink surface and Ambient to maximize heat transfer.

MaxUpgrades offers Fully Buffered DIMMs with Mac Pro Compatible Heat Sinks.





P/N Part Description
SZ-FB667ECC4GBX6AS 24GB kit (6x4GB) DDR2 PC2-5300: Fully Buffered • ECC • DDR2-667 w/Mac Pro Compatible HeatSinks
  • 240-pin Fully buffered DIMM
  • ECC (x72)
  • DDR2 PC5300
  • Apple Qualified Heat Sinks for Optimum Cooling
  • 1 Year Warranty
  • 100% Tested on Apple Mac Pro System


Corona, CA | 951.278.0832 |