MaxSink: HeatSink for Fully Buffered DIMM Memory Module
MaxUpgrades offers MaxSink, a heatsink designed to provide
effective heat disspation of fully buffered DIMM memory modules
operating at high speed 800 MHz or 667 Mhz (Mac Pro Systems) . MaxSink unique design allows
heat generated from memory chips and Advance Memory Buffer to be
effectively disspated while keeping the temperature of the memory
module under operating limits.
MaxSink Features:
• Maximum Surface Area for Optimum Heat Dissipation.
• Precision Machined Aluminum HeatSink.
• Unique mounting for uniform pressure distribution.
• Lowest Thermal resistance between DRAM Chips (FBGA) and HeatSink
for optimized heat transfer.
• Designed for fluctuating Memory Module temperature variations. (Heat Load)
• Step HeatSink design to incorporate thickness variation of AMB and FBGA (RAM Chips.
• HeatSink Surface Treated to minimize Thermal Resistance between HeatSink surface and Ambient to maximize heat transfer.
MaxUpgrades offers Fully Buffered DIMMs with Apple Orignal Heat Sinks.
P/N
Part Description
SZ-MAXSINK02
MaxSinks for Two Fully Buffered DIMMs
Four pieces of Aluminum HeatSink (Top and Bottom Side)
Interface Pads for heat conductivity between DRAM and HeatSinks (Top and Bottom Side)
HeatSink Mounting Screws and Spring for attaching heatsink to the Fully Buffered DIMM Modules
To install the heatSinks on two Fully buffered DIMMS (Mac Pro)
